| ROIS-i2 Specifications | |
| Item | ROIS-i2 |
| General | |
| Operating power/Max power | 6KW/16KW |
| PCB dimension | Min50x50—Max PCB W457.2 x L508mm (18″ x 20″) (Two nozzle solder individually) Max PCB W508 x L508mm (20″ x 20″) (Two nozzle solder parallel) |
| Machine dimension | 1420(L)*1725(W)*1700(H) |
| Net weight | 900KG |
| Power supply | 3PH 380V 50HZ |
| Air supply | 3-5 bars |
| Exhausting required | 800M3/h |
| PC | Yes |
| Typical Program Time | 10 Minutes |
| PCB Robotic Platform | |
| Flux Nozzle Type | drop jet fluxer made in Germany |
| Flux Nozzle Quantity | Standard equip 1 set, optional to equip another set |
| Flux Tank Capacity | 1L |
| Flux Tank Quantity | Standard equip 1 set, optional to equip another set (when use two different flux) |
| preheat | |
| Preheating method | Top IR preheat,option with bottom preheat |
| Solder Management | |
| Solder pot type | Standard equipped with mechanical pump, optional with electromagnetic pump (made in Germany) |
| Standard Solder Stations | 2 |
| Solder Pot Capacity | 15 kgs |
| Solder Temperature Control | PID |
| Heat-Up Time | About 40mins |
| Max Temperature | 350 ℃ |
| Mini Wave Nozzles | 3 to 12mm |
| Customized nozzle | Available |
| Axes of Motion | X, Y, Z1, Z2 |
| Position Accuracy | + / – 0.05mm |
| (N2) Inertion Management | |
| N2 Consumption per Nozzle | 4m3/H |
| Required N2 Purity | >99.99% |
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